Printed metal gasket
US11793059B2 · kind B2 · utility
0Cited by
22References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 5, 2021 |
| Grant date | Oct 17, 2023 |
| Priority date | — |
| Expiry date | Apr 20, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/821
Abstract
Techniques and devices are provided for attaching a die to a metal manifold. A metal-containing ink is used to deposit a metal trace on the die and thereby to form a gasket, after which the die is compressed against the manifold to form a sealed connection between the two.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.