Dual area bi-injection molding
US11794388B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2022 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Jun 2, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3481
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Forming a casing of an information handling system using dual area bi-injection, the method including injecting a first material into a mold: i) at first locations of the mold to form a first portion of a casing, and ii) at second locations of the mold to form a second portion of the casing; and injecting a second material into the mold at third locations of the mold to form a third portion of the casing; wherein injection of the first material and the second material into the mold is done concurrently, wherein injection of the first and the second material into the mold forms a first bonding interface and a second bonding interface between the first material and the second material such that the second material is excluded from ingression to the first portion and the second portion of the casing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.