Hybrid sensing system
US11796405B2 · kind B2 · utility
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5References
19Claims
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Key dates
| Filing date | Mar 18, 2021 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Sep 1, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2203/04105
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A hybrid strain sensing system and the method of making such a system provides a thin semiconductor film with strain sensors and signal processing circuits integrated deposited thereon. The semiconductor film may be further processed and then mounted onto a substrate to be used for strain, force, or other related measurements. The system combines the high sensitivity of a semiconductor strain gauge with the high level of integration of semiconductor integrated circuits (IC)s. Both are highly desirable features for applications where miniaturization and/or flexibility are important requirements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.