Systems and methods for simulating printed circuit board components
US11797731B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 11, 2020 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Jan 31, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2115/12
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods for simulating a circuit board design include receiving a printed circuit board design comprising an electronic component and a dielectric board, generating a first finite element model of the dielectric board independent of the electronic component, and generating a second finite element model for the electronic component. The method further includes combining the first finite element model with the second finite element model to obtain a final finite element model for the printed circuit board design.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.