Electrodeposition of thermally stable alloys
US11798583B1 · kind B1 · utility
1Cited by
16References
7Claims
0Family size
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Key dates
| Filing date | Sep 17, 2021 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Dec 8, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/3909
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method includes immersing a wafer in an electrolyte including a plurality of compounds having elements of a thermally stable soft magnetic material. The method also includes applying a combined stepped and pulsed current to the wafer when the wafer is immersed in an electrolyte. The wafer is removed from the electrolyte when a layer of the thermally stable soft magnetic material is formed on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.