Copper microparticles
US11798707B2 · kind B2 · utility
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Key dates
| Filing date | Jan 10, 2019 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | May 16, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/50
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Provided are copper microparticles which have exceptional oxidation resistance, in which oxidation is reduced even when the copper microparticles are held at a firing temperature in an oxygen-containing atmosphere, and in which sintering also occurs. The copper microparticles have a particle diameter of 10-100 nm, have a surface coating material, and are such that, after the copper microparticles are held for one hour at a temperature of 400° C. in an oxygen-containing atmosphere, the particle diameter exceeds 100 nm while a copper state is retained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.