Multilayer electronic component
US11798747B2 · kind B2 · utility
1Cited by
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15Claims
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Key dates
| Filing date | Oct 24, 2022 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Oct 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/232
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component include a first non-conductive resin layer, extending between a conductive resin layer and an electrode layer of a first external electrode, and a second non-conductive resin layer extending between a conductive resin layer and an electrode layer of a second external electrode. The first non-conductive layer and the second non-conductive layer may be spaced apart from each other to suppress arc discharge and to improve bending strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.