Fluidic flow channel over active surface of a die
US11798854B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Aug 18, 2022 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Aug 18, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided herein include various examples of an apparatus, a sensor system and examples of a method for manufacturing aspects of an apparatus, a sensor system. The apparatus may include a die. The apparatus may also include a substrate comprising a cavity. The die may be oriented in a portion of the cavity in the substrate, where the orientation defines a first space in the cavity adjacent to a first edge of the upper surface of the die and a second space in the cavity adjacent to the second edge of the upper surface of the die. The apparatus may further include fluidics fan-out regions comprising a first cured material deposited in the first space and the second space, a surface of the fluidics fan-out regions being contiguous with the upper surface of the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.