Patent · US Active

Semiconductor assembly

US11798873B2 · kind B2 · utility

0Cited by

5References

11Claims

0Family size

Assignee

VITESCO TECHNOLOGIES GMBH · DE

Inventors

Detlev Bagung · Bernhardswald, DE
Thomas Riepl · Bad Abbach, DE
Daniela Wolf · Munich, DE
Christina Quest-Matt · Munich, DE

Key dates

Filing date	Oct 5, 2018
Grant date	Oct 24, 2023
Priority date	—
Expiry date	Oct 24, 2039

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor assembly includes a semiconductor component having a redistribution substrate with a top side, an underside and a semiconductor chip on the top side. Contact connection pads for connection to contact pads of the chip are on the top side of the substrate. External contact pads on the underside are electrically connected to the contact connection pads by conductor tracks. The external contact pads are at a greater distance from one another in a first region than a second region of the underside. The semiconductor component is on a printed circuit board. Contact pads corresponding to the external contacts are on a top side of the printed circuit board and are at a greater distance from one another in a first region than a second region of the top side. Through holes are formed between the contact pads in the first region of the printed circuit board.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.