Method for manufacturing display device and substrate for manufacturing display device
US11798921B2 · kind B2 · utility
0Cited by
16References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2021 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Nov 18, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Discussed is an assembly substrate used for a display device manufacturing method of mounting semiconductor light-emitting diodes on the assembly substrate at preset positions using electric field and magnetic field. The assembly substrate includes a base portion, a plurality of assembly electrodes on the base portion, a dielectric layer on the base portion to cover the assembly electrodes, a barrier wall on the base portion, and a metal shielding layer on the base portion, wherein the metal shielding layer overlaps the barrier wall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.