Method of manufacturing light-emitting device
US11799053B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 25, 2021 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Jan 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/018
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a light-emitting device includes: providing a structure body including: a first substrate having a first surface and a second surface opposite to the first surface, the first surface including first regions and second regions; first light-emitting element portions respectively located on the first regions; and second light-emitting element portions respectively located on the second regions; fixing the first light-emitting element portions to a second substrate without fixing the second light-emitting element portions to the second substrate; subsequently, transferring the first light-emitting element portions from the first substrate to the second substrate by removing, from the second surface, portions of the first substrate overlapping the first regions when viewed from the second surface; and subsequently, separating the first light-emitting element portions from the second substrate in a state in which the second light-emitting element portions are located on the second regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.