Acoustic wave device with multi-layer interdigital transducer electrode
US11799445B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2021 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Dec 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/64
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
Aspects of this disclosure relate to an acoustic wave device that includes a multi-layer interdigital transducer electrode. The acoustic wave device includes a piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer. The interdigital transducer electrode includes a first interdigital transducer electrode layer positioned between a second interdigital transducer electrode layer and the piezoelectric layer. The second interdigital transducer electrode layer can include aluminum and having a thickness of at least 200 nanometers. The acoustic wave device can include a temperature compensation layer arranged such that the interdigital transducer electrode is positioned between the piezoelectric layer and at least a portion of the temperature compensation layer. Related filters, modules, wireless communication devices, and methods are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.