Reduced light reflection package
US11800297B2 · kind B2 · utility
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2References
28Claims
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Key dates
| Filing date | Oct 5, 2021 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Jan 22, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.