Electronic device having heat-radiating structure
US11800632B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 24, 2019 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Oct 14, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09063
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to various embodiments, an electronic device may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate, a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate, a first electronic component mounted on the first PCB between the first PCB and the middle plate, a first heat transfer structure disposed between the first electronic component and the middle plate, a second electronic component including a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face substantially perpendicular to the first surface or the second surface, and a second heat transfer structure. The second heat transfer structure may include a first thermal conductive layer including a first portion attached to the first surface or the second surface, and a second portion extending from the first portion toward the middle plate and at least partially having a th…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.