Heat dissipation structure and electronic device including same
US11800688B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2019 |
| Grant date | Oct 24, 2023 |
| Priority date | — |
| Expiry date | Feb 27, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embodiment of the present invention discloses a heat dissipation structure and an electronic device including the heat dissipation structure, the heat dissipation structure comprising: at least one heat dissipation plate; at least one rigid plate which forms an opening in one area and is coupled to the upper portion of the at least one heat dissipation plate to support durability of the at least one heat dissipation plate; at least one heat pipe of which at least a portion is accommodated in the opening formed by the at least one rigid plate and is coupled to an area of the at least one heat dissipation plate that faces the at least one heat pipe; and at least one fixing tool which supports the fixing between the at least one heat dissipation plate and the at least one rigid plate. In addition, various embodiments identified through the specification are possible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.