MEMS multiaxial angular rate sensor
US11802768B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 9, 2022 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Apr 30, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01C19/5712
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A MEMS multiaxial angular rate sensor includes a substrate and a MEMS wafer layer correspondingly deposited and parallel to each other, and a plurality of anchors coupled to the MEMS wafer layer and fixing the MEMS wafer layer onto the substrate. The MEMS wafer layer includes at least two drive-sensing structures, a third driving ring and two pendulum masses. Each of the drive-sensing structures includes a driving ring, a plurality of driving comb pair structures and a plurality of sensing proof masses respectively coupled to the corresponding driving ring. A third driving ring is coupled to and deposited between the two driving rings of the two drive-sensing structures. In a driving mode, those driving comb pair structures drive the corresponding driving rings to perform periodical rotation motions, and the two driving rings in periodical rotation motions further actuate the third driving ring to perform periodical rotation motion together. Two pendulum masses are respectively coupled to the third driving ring and deposited at opposite two sides of the third driving ring.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.