Patent · US Active

Seamless stitching for multi-reticle fabrication of integrated photonics optical components

US11803013B2 · kind B2 · utility

0Cited by

16References

18Claims

0Family size

Assignee

Anello Photonics, Inc. · US

Inventors

Avi Feshali · Los Angeles, US
Warren Bruce Jin · Goleta, US
Mario Paniccia · Santa Clara, US

Key dates

Filing date	Mar 31, 2022
Grant date	Oct 31, 2023
Priority date	—
Expiry date	Mar 31, 2042

Classification

Technology area (CPC G)Physics
CPC primaryG02B2006/12173
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Aspects of the present disclosure are directed to fabrication of large-footprint chips having integrated photonic components comprising low-loss optical waveguides. The large footprint chips require the use of multiple reticles during fabrication. Stitching adjacent reticle fields seamlessly is accomplished by overlaying into adjacent reticle fields, tapering waveguide ends, and using strategically placed alignment marks in the die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.