Photosensitive resin composition having improved adhesiveness or adhesion and light blocking layer using same
US11803123B2 · kind B2 · utility
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2References
9Claims
0Family size
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Key dates
| Filing date | Oct 15, 2018 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Mar 6, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K50/865
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition comprising (A) a cardo-based resin comprising a repeating unit represented by chemical formula 1 (comprising chemical formula 4); (B) a reactive unsaturated compound; (C) a pigment; (D) an initiator; and (E) a solvent, and a light blocking layer using the same having improved adhesiveness or adhesion are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.