Systems for integrated decomposition and scanning of a semiconducting wafer
US11804390B2 · kind B2 · utility
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16References
20Claims
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Key dates
| Filing date | Dec 27, 2021 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Dec 27, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods are described for integrated decomposition and scanning of a semiconducting wafer, where a single chamber is utilized for decomposition and scanning of the wafer of interest.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.