Parallel assembly of discrete components onto a substrate
US11804397B2 · kind B2 · utility
1Cited by
20References
37Claims
0Family size
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Key dates
| Filing date | Nov 15, 2021 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Nov 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/851
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes transferring multiple discrete components from a first substrate to a second substrate, including illuminating multiple regions on a top surface of a dynamic release layer, the dynamic release layer adhering the multiple discrete components to the first substrate, each of the irradiated regions being aligned with a corresponding one of the discrete components. The illuminating induces a plastic deformation in each of the irradiated regions of the dynamic release layer. The plastic deformation causes at least some of the discrete components to be concurrently released from the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.