Semiconductor device
US11804423B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2022 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | May 14, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/668
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor element, which has a protective film having an opening that exposes a part of a source electrode and disposed/provided to position an end portion thereof on the source electrode. A rewiring layer has wiring that is connected to the source electrode and to a conductive connecting member, and an insulator that covers a part of the source wiring. The insulator includes: an insulating film having (a) an opening for exposing a part of the source wiring, and (b) an end portion of the opening provided in a facing region of the opening; and an insulating film having (c) (i) an opening for exposing a part of the source wiring having a solder arranged therein and (ii) a connecting member arranged therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.