Devices and methods related to stack structures including passivation layers for distributing compressive force
US11804460B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2022 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Feb 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/35121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Structures, methods and devices are disclosed, related to improved stack structures in electronic devices. In some embodiments, a stack structure includes a pad implemented on a substrate, the pad including a polymer layer having a side that forms an interface with another layer of the pad, the pad further including an upper metal layer over the interface, the upper metal layer having an upper surface. In some embodiments, the stack structure also includes a passivation layer implemented over the upper metal layer, the passivation layer including a pattern configured to provide a compressive force on the upper metal layer to thereby reduce the likelihood of delamination at the interface, the pattern defining a plurality of openings to expose the upper surface of the upper metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.