ALD preparation method for eliminating camera module dot defects and product thereof
US11804501B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2020 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Jun 6, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/014
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An ALD preparation method for eliminating camera module dot defects includes: placing a base substrate in a reaction chamber, and heating to 100-400° C.; introducing a first reaction precursor into the reaction chamber to chemically adsorb the first reaction precursor on the base substrate to form a first film layer; removing the excess first reaction precursor, and purging with inert gas; introducing a second reaction precursor into the reaction chamber to create a reaction between the second reaction precursor and the first reaction precursor to form a first refractive index layer; removing the excess second reaction precursor and a by-product of the reaction, and purging with inert gas; introducing a third reaction precursor into the reaction chamber to chemically adsorb the third reaction precursor on a surface of the first refractive index layer to form a second film layer; and removing the excess third reaction precursor, and purging with inert gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.