Piezoelectric mems microphone chip and piezoelectric mems microphone
US11805371B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2023 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | May 23, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present application discloses a piezoelectric micro electrical mechanical system (MEMS) microphone chip and a piezoelectric MEMS microphone, and relates to the technical field of piezoelectric devices. The piezoelectric MEMS microphone chip includes at least one substrate frame and at least one plurality of sound receiving beams arranged on the substrate frame. Each of the sound receiving beams includes a connecting beam and a cantilever beam. The connecting beam and the cantilever beam are staggered on a circumference. One ends of the plurality of sound receiving beams that face a geometric center of the a circumference are fixedly connected to one another in a center defined by the substrate frame, and one end of the connecting beam that is away from the geometric center is fixedly connected to the substrate frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.