MEMS chip
US11805373B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2021 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Mar 30, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2410/03
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure discloses a MEMS chip which includes a substrate, a back plate fixed on the substrate, and a membrane fixed on the substrate and located above the back plate. A sealed space is formed between the membrane and the back plate. A support pillar is received in the sealed space. Two ends of the support pillar along a vibration direction of the membrane are separately fixed on the membrane and the back plate. As a result, when decreasing the volume of the back cavity, the resonance frequency of the MEMS chip has been effectively improved and the SNR is simultaneously high. Furthermore, the support pillar can effectively improve the reliability and crack resistance of the membrane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.