Memory auxiliary heat transfer structure
US11805621B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 7, 2020 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | May 31, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A memory auxiliary heat transfer structure is correspondingly assembled with at least one memory unit and a water-cooling assembly. The memory auxiliary heat transfer structure includes a main body. The main body has a first end, a second end and a middle section. The middle section has a heated side and a contact side. The heated side is disposed corresponding to at least one chip disposed on the memory unit. The contact side is attached to and assembled with the water-cooling assembly. The memory auxiliary heat transfer structure serves to reduce the friction between the memory unit and the water-cooling assembly and fill the gap so as to reduce the heat resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.