Encapsulation structure, electronic apparatus and encapsulation method
US11805667B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
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Key dates
| Filing date | Sep 23, 2019 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Oct 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/8731
Abstract
An encapsulation structure, an electronic apparatus, and an encapsulation method are provided. The encapsulation structure includes: a base substrate, an organic encapsulation layer and a barrier dam that are on the base substrate. The barrier dam is disposed outside the organic encapsulation layer; and the barrier dam includes an upper surface away from the base substrate and a side surface facing the organic encapsulation layer, and at least one of the upper surface and the side surface includes a groove and a protrusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.