Package structure, method for forming package structure, display panel and display device
US11805676B2 · kind B2 · utility
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Key dates
| Filing date | Sep 13, 2021 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Sep 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/8794
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package structure, a method for forming a package structure, a display panel and a display device are provided. The package structure includes: a polarizing structure and a first optical adhesive layer; the polarizing structure includes a first viewing aperture corresponding to a camera; the first optical adhesive layer is arranged at a side of the polarizing structure, and at least a part of the first viewing aperture is filled with the first optical adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.