Electronic device including conductive adhesive layer
US11805685B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2021 |
| Grant date | Oct 31, 2023 |
| Priority date | — |
| Expiry date | Dec 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73204
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present application relates to an electronic device. The electronic device includes a first electronic component and a second electronic component. The first electronic component includes a first pad area including first pads and second pads spaced apart from the first pads. A number of the first pads is greater than a number of the second pads. The second electronic component includes first bumps electrically connected to the first pads, and second bumps electrically connected to the second pads. Each of the second bumps has a bonding area greater than a bonding area of each of the first bumps. A conductive adhesive layer is disposed between the first electronic component and the second electronic component to electrically connect the first pads to the first bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.