Ultrasound transducer and method for wafer level front face attachment
US11806752B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2020 |
| Grant date | Nov 7, 2023 |
| Priority date | — |
| Expiry date | Apr 2, 2042 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B8/4483
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Methods and systems are provided for a single element ultrasound transducer. In one embodiment, a method for the transducer comprises laminating a comb structure and a conductive base package into an acoustic stack with a non-conductive glue, grinding the acoustic stack, and dicing the ground acoustic stack along a plane extending from the top surface of the second fin of the conductive base package to the bottom surface of the acoustic stack. The resulting transducer may have a flat front face with a non-conductive groove separating a ground pad formed by the conductive base package from a signal pad formed by a matching layer of the comb structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.