Phenoxy resin, resin composition including same, cured object obtained therefrom, and production method therefor
US11807711B2 · kind B2 · utility
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15Claims
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Key dates
| Filing date | Dec 9, 2019 |
| Grant date | Nov 7, 2023 |
| Priority date | — |
| Expiry date | Aug 12, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0158
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided are a phenoxy resin having excellent heat resistance, low hygroscopicity, and solvent solubility, a resin composition using the same, and a cured object obtained therefrom. The phenoxy resin is represented by Formula (1) below and has an Mw of 10,000 to 200,000: where, X represents a divalent group, and includes, essentially, a group having a cyclohexane ring structure and a group having a fluorene ring structure. Y represents a hydrogen atom or a glycidyl group. n is the number of repetitions and an average value thereof is 25 to 500.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.