Methods of forming cutting elements and supporting substrates for cutting elements
US11807920B2 · kind B2 · utility
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78References
20Claims
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Key dates
| Filing date | May 10, 2022 |
| Grant date | Nov 7, 2023 |
| Priority date | — |
| Expiry date | May 10, 2042 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B10/55
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, one or more of Al, Be, Ga, Ge, Si, and Sn, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, W, C, and one or more of Al, Be, Ga, Ge, Si, and Sn. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.