Electroplating device and electroplating system
US11807953B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 29, 2022 |
| Grant date | Nov 7, 2023 |
| Priority date | — |
| Expiry date | Mar 16, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating device for electroplating an alloy comprising a plurality of metals on a workpiece includes an electroplating bath, a plurality of groups of anodes, and a power supply device. The electroplating bath contains an electroplating solution in which the workpiece as a cathode is at least partially immersed. Each of the plurality of groups of anodes provides at least one metal required for electroplating. An electrolytic potential of at least one metal of each group of anodes is distinct from that of at least one metal of any other group of anodes. The power supply device adjusts the proportion of current transmitted to each group of anodes according to the proportion of the metals in the alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.