Patent · US Active

Multistage micromechanical timepiece and method for making same

US11809136B2 · kind B2 · utility

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0References

11Claims

0Family size

Assignee

CSEM CENTRE SUISSE D'ELECTRONIQUE ET DE MICROTECHNIQUE SA—RECHERCHE ET DÉVELOPPEMENT · CH

Inventors

Michel Despont · Adliswil, CH
Philippe Niedermann · Peseux, CH

Key dates

Filing date	Feb 7, 2018
Grant date	Nov 7, 2023
Priority date	—
Expiry date	Feb 23, 2041

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C1/00142
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A micromechanical timepiece, and a method for making the same, having a plurality of mutually secured functional sub-assemblies stacked in a direction (Z) to form a multistage assembly, wherein each functional sub-assembly comprises a single semiconductor material and is secured to another sub-assembly via bridges made of the semiconductor material, and in that at least one sub-assembly comprises at least two portions, the portions being movable relative to each other and relative to another sub-assembly to which at least one of the portions is secured via at least one deformable link integrally formed between the portions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.