Composite encapsulating material and photovoltaic module including the same
US11810777B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Aug 21, 2020 |
| Grant date | Nov 7, 2023 |
| Priority date | — |
| Expiry date | Feb 24, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided is a composite encapsulating material and a photovoltaic module encapsulated with the composite encapsulating material, which relate to the technical field of photovoltaic modules. At least a partial area of the composite encapsulating material includes a high insulation material, and the high insulation material includes polyimide, modifier and modified polyimide. The above technical solution can improve an insulation performance of the encapsulating material, reduce a blank area of an edge of the module, reduce a weight of the photovoltaic module, and further reduce comprehensive cost of the photovoltaic module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.