Semiconductor chip and method for manufacturing the same
US11810821B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Apr 13, 2021 |
| Grant date | Nov 7, 2023 |
| Priority date | — |
| Expiry date | Aug 17, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A semiconductor chip includes: an epitaxial film made of gallium nitride; a semiconductor element disposed in the epitaxial film; a chip formation substrate including the epitaxial film and having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface; and a convex and a concavity on the side surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.