Systems for providing thermal management to integrated circuits

US11810836B2 · kind B2 · utility

Assignee

• Arista Networks, Inc. · US

Inventors

• Tiffany Doria · Fremont, US
• Robert Wilcox · Santa Clara, US
• Richard Hibbs · Sacramento, US
• Tiong Khai Soo · Milpitas, US
• Ernest Mason Thurlow · Mountain View, US
• Zidong Lin · Rongcheng District, CN

Key dates

• Filing date: Jun 9, 2020
• Grant date: Nov 7, 2023
• Expiry date: Dec 4, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2023/4087
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A processing unit disposed within a compute unit, where the compute unit includes a printed circuit board (PCB) that includes an integrated circuit; a first thermal management device, that includes a first vapor chamber thermally conductively coupled to a first side of the integrated circuit; and a first heatsink thermally conductively coupled to the first vapor chamber; and a second thermal management device, that includes a second vapor chamber; and a second heatsink thermally conductively coupled to the second vapor chamber, where the second thermal management device is thermally conductively coupled to the first thermal management device; where the PCB is interposed between the first thermal management device and the second thermal management device.