Patent · US Active

Carrier, assembly comprising a substrate and a carrier, and method for producing a carrier

US11810845B2 · kind B2 · utility

0Cited by

3References

7Claims

0Family size

Assignee

Osram OLED GMBH · DE

Inventors

Jörg Erich Sorg · Regensburg, DE
Konrad Wagner · Friedberg, DE
Michael Forster · Altenthann, DE
Josef Hirn · Schwandorf, DE

Key dates

Filing date	Oct 30, 2018
Grant date	Nov 7, 2023
Priority date	—
Expiry date	Oct 30, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/0365
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Carrier with an electrically insulating base material, electrically conductive through-connections and a thermal connection element. The through-connections and the thermal connection element are each completely surrounded by the base material in the lateral direction, the thermal connection element and the through-connections completely penetrating the base material perpendicularly to the main extension plane of the carrier, and the thermal connection element being formed with a material which has a thermal conductivity of at least 200 W/(m K).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.