Sensor
US11810863B2 · kind B2 · utility
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0References
15Claims
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Assignee
Inventors
Key dates
| Filing date | Jun 4, 2019 |
| Grant date | Nov 7, 2023 |
| Priority date | — |
| Expiry date | Aug 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sensor is provided, including a substrate, a chip and a sensing element. The substrate has a plate-like shape and includes a surface and an interconnect structure disposed in the substrate. The chip is embedded in the substrate and is electrically connected to the interconnect structure. The sensing element is disposed on the surface of the substrate, and is electrically connected to the chip through the interconnect structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.