Diode laser assembly and method for assembling a diode laser assembly

US11811192B2 · kind B2 · utility

Assignee

• TRUMPF Photonics, Inc. · US

Inventors

• Stephan Strohmaier · Berlin, DE
• Arne-Heike Meissner-Schenk · Berlin, DE
• Gerald Urban · Neuzelle, DE
• Gerd Hansen · Berlin, DE
• Christian Carstens · Bad Honnef, DE

Key dates

• Filing date: Jun 18, 2019
• Grant date: Nov 7, 2023
• Expiry date: Jul 9, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01S5/02469
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

A diode laser arrangement includes a diode laser device, first and second cooling elements and at least one spacing device. The laser device and spacing device are mutually spaced apart between the first and second cooling elements. The laser device and the spacing device are disposed on respective first and second outer surfaces of respective cooling elements. The first and second cooling elements cool the laser device. The laser device has first and second diode main surfaces. The first diode main surface is on the first outer surface in a first front region and/or the second diode main surface is on the second outer surface in a second front region. The spacing device places the first outer surface in the first front region parallel to the first diode main surface, and/or the second outer surface in the second front region parallel to the second diode main surface.