Contact pad with electrical connection structure for connecting a piezoelectric element and an electrical circuit with a conductive adhesive
US11811335B2 · kind B2 · utility
0Cited by
11References
5Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 1, 2021 |
| Grant date | Nov 7, 2023 |
| Priority date | — |
| Expiry date | Sep 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/875
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrical connection structure for connecting a piezoelectric element and an electrical circuit to each other with a conductive adhesive is described. The electrical connection structure includes an epoxy, a conductive component surrounded by the epoxy, and a trace feature implemented on top of the electrical connection structure. At least one depression feature can be implemented on top of the electrical connection structure to constrain the epoxy and the at least one conductive component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.