Method and apparatus for dermatological treatment
US11813218B2 · kind B2 · utility
0Cited by
4References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 9, 2021 |
| Grant date | Nov 14, 2023 |
| Priority date | — |
| Expiry date | Apr 9, 2041 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61K2800/95
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
Exemplary methods and systems can be provided for resurfacing of skin that include formation of a plurality of small holes, e.g., having widths greater than about 0.2 mm and less than about 0.7 mm or 0.5 mm, using a mechanical apparatus. Compressive and/or tensile forces can then be applied to the treated region of skin as the damage heals to facilitate hole closure, and provide enhanced and/or directional shrinkage of the treated skin area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.