Patent · US Active

Implant and method for assembling an implant

US11813469B2 · kind B2 · utility

1Cited by

5References

9Claims

0Family size

Assignee

BIOTRONIK SE & Co. KG · DE

Inventors

Thomas Doerr · Berlin, DE
Ulrich Feese · Berlin, DE
Rolf Klenner · Michendorf, DE
Torsten Oertmann · Schildow, DE

Key dates

Filing date	Jul 22, 2019
Grant date	Nov 14, 2023
Priority date	—
Expiry date	Sep 11, 2039

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldMedical technology
WIPO sectorInstruments

Abstract

The disclosure relates to an implant comprising a housing, in which there are arranged an energy store and an electronics module, wherein a feedthrough to an electrode connection device is formed on the housing, wherein a first contact forms an electrical connection between the energy store and the electronics module, wherein a second contact forms an electrical connection between the electronics module and the feedthrough, and wherein the first contact and the second contact are oriented in the same contact direction. A method for assembling an implant is also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.