Three-dimensional, additive manufacturing system, and a method of manufacturing a three-dimensional object
US11813792B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2022 |
| Grant date | Nov 14, 2023 |
| Priority date | — |
| Expiry date | Aug 10, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y50/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A three-dimensional, additive manufacturing system is disclosed. The first and second printer modules form sequences of first patterned single-layer objects and second patterned single-layer objects on the first and second carrier substrates, respectively. The patterned single-layer objects are assembled into a three-dimensional object on the assembly plate of the assembly station. A controller controls the sequences and patterns of the patterned single-layer objects formed at the printer modules, and a sequence of assembly of the first patterned single-layer objects and the second patterned single-layer objects into the three-dimensional object on the assembly plate. The first transfer module transfers the first patterned single-layer objects from the first carrier substrate to the assembly apparatus in a first transfer zone and the second transfer module transfers the second patterned single-layer objects from the second carrier substrate to the assembly apparatus in a second transfer zone. The first and second printer modules are configured to deposit first and second materials under first and second deposition conditions, respectively. The first and second materials are differe…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.