Epoxy dual cure resins for additive manufacturing
US11814472B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2021 |
| Grant date | Nov 14, 2023 |
| Priority date | — |
| Expiry date | Sep 23, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/05
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An epoxy dual cure resin useful for additive manufacturing of three-dimensional objects includes: (i) a photoinitiator; (ii) monomers and/or prepolymers that are polymerizable by exposure to actinic radiation or light; (iii) optionally, a light absorbing pigment or dye; (iv) an epoxy resin; (v) optionally, but in some embodiments preferably, an organic hardener co-polymerizable with the epoxy resin; (vi) optionally but preferably a dual reactive compound having substituted thereon a first reactive group reactive with said monomers and/or prepolymers that are polymerizable by exposure to actinic radiation or light, and a second reactive group reactive with said epoxy resin (e.g., an epoxy acrylate); (vii) optionally a diluent; (viii) optionally a filler; and (ix) optionally, a co-monomer and/or a co-prepolymer. Methods of using the same in additive manufacturing are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.