Stabilized metal monolayer structure
US11814723B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Oct 22, 2018 |
| Grant date | Nov 14, 2023 |
| Priority date | — |
| Expiry date | Jan 4, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/268
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A stabilized elementary metal structure is disclosed. The stabilized elementary metal structure may include an elementary metal having at least one layer and having a two-dimensional layer structure, and an organic molecular layer provided on at least one of a top surface and a bottom surface of the elementary metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.