Plating membrane
US11814743B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 15, 2020 |
| Grant date | Nov 14, 2023 |
| Priority date | — |
| Expiry date | Jul 21, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating membrane includes a support structure extending radially outward from a nozzle that is to direct a flow of a plating solution toward a wafer. The plating membrane also includes a frame, supported by the support structure, having an inner wall that is angled outward from the nozzle. The outward angle of the inner wall relative to the nozzle directs a flow of plating solution from the nozzle in a manner that increases uniformity of the flow of the plating solution toward the wafer, reduces the amount of plating solution that is redirected inward toward the center of the plating membrane, reduces plating material voids in trenches of the wafer (e.g., high aspect ratio trenches), and/or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.