Electronics unit with integrated metallic pattern
US11817377B2 · kind B2 · utility
0Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2022 |
| Grant date | Nov 14, 2023 |
| Priority date | — |
| Expiry date | Aug 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A non-conductive encapsulation cover is mounted on a support face of a support substrate to delimit, with the support substrate, an internal housing. An integrated circuit chip is mounted to the support substrate within the internal housing. A metal pattern is mounted to an internal wall of the non-conductive encapsulation cover in a position facing the support face. At least two U-shaped metal wires are provided within the internal housing, located to a side of the integrated circuit chip, and fixed at one end to the metallic pattern and at another end to the support face.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.