Electronic apparatus
US11817388B2 · kind B2 · utility
0Cited by
1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2022 |
| Grant date | Nov 14, 2023 |
| Priority date | — |
| Expiry date | Jun 28, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D88/101
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure provides an electronic apparatus. The electronic apparatus includes a substrate, a first metal layer, an insulating layer, a first conductor, an electronic assembly and a transistor circuit die. The first metal layer is disposed on the substrate. The insulating layer is disposed on the substrate. The first conductor is formed in a first via of the insulating layer. The electronic assembly is disposed on the substrate and electrically connected to the first metal layer through the first conductor. The transistor circuit die is electrically connected to the first metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.