Conductive paste
US11817398B2 · kind B2 · utility
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1References
9Claims
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Key dates
| Filing date | Sep 24, 2019 |
| Grant date | Nov 14, 2023 |
| Priority date | — |
| Expiry date | Sep 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A conductive paste contains (A) copper fine particles having an average particle diameter of 50 nm to 400 nm and a crystallite diameter of 20 nm to 50 nm, (B) copper particles having an average particle diameter of 0.8 μm to 5 μm and a ratio of a crystallite diameter to the crystallite diameter of the copper fine particles (A) of 1.0 to 2.0, and (C) a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.